Elippse
Printed electronics for overmoulded plastic parts
Our concept
A complete value chain
For the development of a French value chain dedicated to structural electronics, design and manufacturing of smart plastic products based on In-Mold Electronics.
The growing demand for electrotechnical products with embedded functionalities related to the Internet of Things (IoT) benefits from the new possibilities offered by printed electronics and In-Mould Electronics (IME) technologies. These technologies enable a miniaturisation of the functional devices, as well as an improvement of the products ergonomics and reliability, especially in the case of Human-Machine Interfaces (HMI). Both electronics and mechanical functions are closely integrated and new functionalities can be implemented in plastic parts surface.
3 OBJECTIVES
Enable the miniaturisation and the manufacturing of mechatronics devices, in particular for the IoT (Internet of Things).
Implement electronics functionalities on 3D plastic parts surfaces with a high level of reliability thanks to industrial processes.
Increase the combination of electronics and mechanical functionalities for size, weight, reliability and cost optimisation.
Enable the miniaturisation and the manufacturing of mechatronics devices, in particular for the IoT (Internet of Things).
Implement electronics functionalities on 3D plastic parts surfaces with a high level of reliability thanks to industrial processes.
Increase the combination of electronics and mechanical functionalities for size, weight, reliability and cost optimisation.
An opportunity for new markets
Our expertise
Innovative IME technology
The ELIPPSE project is developing an innovative technology based on the integration of a functional film with printed electronics and Surface Mounted Devices (SMD) into 3D plastic parts with complex geometry : In-Mould Electronics technology. This approach enables the manufacturing of high-added value structural electronics parts, with optimal combination of electronics and mechanical functions.
The IME technology developed in this way uses the following processes
- functional ink formulation
- screen printing
- component pick-&-place
- thermoforming
- and overmoulding
The Consortium
The partners
Complementary expertise & know-how
The ELIPPSE project consortium brings together the complementary expertise and know-how of companies, laboratories and an industrial technical centre in order to cover the entire value chain of IME plastronic products. The partners' own skills are thus put at the service of the joint development of an innovative technology for tomorrow’s functional plastic products.
Funded by / Label granted by
The ELIPPSE project is co-funded by the European Union in the frame of the European Regional Development Fund (ERDF).
